Exhibitor Information
Description of Event:
Lead-free electronics assembly is now a way of life for companies shipping product into the European Union (EU). This difficult transition of shifting from a well-documented tin/lead to lead-free solder alloy processes still presents several challenges on the assembly line. This workshop gives manufacturers the ability to tackle persistent lead-free assembly problems and issues in a hands-on and classroom-based environment. Leading industry experts will provide suggestions and solutions for lead-free best practices. Participating in this unprecedented learning experience will enable you to analyze and understand a real-world, lead-free manufacturing experience and then take the knowledge back to your company for use with your own products.
RIT CEMA Facility
The hands-on training, coupled with the CEMA facility's complete assembly line make for an ideal educational environment for the attendees.
Attendee Profile:
  • Production, manufacturing or process engineers
  • Technical engineering staff
  • Corporate management
  • Circuit designers, circuit/system packaging designers
Exhibitor Benefits:
  • Small, intimate setting for greater networking and selling
  • Limited number of exhibitors increases your face-to-face selling
  • Variety of sponsorships available to boost your conference exposure
Keynote Address:

Dan Shea, Chief Technology Officer (CTO), Celestica will deliver the keynote address on Tuesday, October 17, during a cocktail reception.

As Celestica's chief technology officer, Dan Shea directs the company's technology leadership by ensuring that Celestica anticipates, identifies, and solves the technology challenges facing OEM customers and the broader electronics industry. Dan Shea oversees all technical aspects of Celestica's compliance with emerging environmental legislation.